Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs

Description

• As a member of the Machine Learning Acceleration team you’ll be responsible for the design and optimization of hardware in our data centers. You’ll provide leadership in the application of new technologies

Description

• As a member of the Machine Learning Acceleration team you’ll be responsible for the design and optimization of hardware in our data centers. You’ll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced, intellectually challenging position, and you’ll work with thought leaders in multiple technology areas. You’ll have high standards for yourself and everyone you work with, and you’ll be constantly looking for ways to improve your products performance, quality and cost. We’re changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today. Key job responsibilities As a Sr. Thermal & Mechanical Packaging Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design including thermal and mechanical solutions and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the hardware that goes into our cutting-edge data centers affecting millions of AWS users.

Basic Qualifications

• - Experience communicating with customers, technical, regulatory, business teams, and management to collect requirements, describe product features, and technical designs - Master's degree in mechanical engineering or equivalent - 5+ years industry experience in advanced packaging of semiconductors. - Direct experience in designing and testing of test vehicles to assess future packaging architectures and evaluating properties of next-generation materials. - Expertise in optimizing in packaging architectures to meet quality, performance, and cost goals. - 10+ years industry experience in mechanical design of semiconductor-based systems – silicon, packaging, and system design. - Industry experience of working with packaging component vendors and ODMs, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization. - Proficiency with simulation tools such as ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK or equivalent FEA/CFD software

Preferred Qualifications