PCB Layout Engineer
ubiquiti • Taipei
No Relocation
Posted: September 24, 2026
Job Description
Responsibilities
- Lead hardware circuit design, schematic capture, and layout review for next-generation, high-density, and high-throughput networking platforms.
- Evaluate and integrate advanced switching architectures, management subsystems, and cutting-edge high-speed interconnect technologies.
- Drive hardware architecture design, system bring-up, high-speed signal integrity (SI) validation, and root-cause failure analysis.
- Partner with mechanical, thermal, and power engineering teams to address challenges related to high power density, thermal dissipation, and system-level reliability.
- Own BOM structure and support factory deployment to ensure seamless transition of high-layer-count PCBAs from NPI to mass production.
- Collaborate with cross-functional software, firmware, QA, and compliance teams throughout the entire product lifecycle.
Qualifications
- Bachelor’s degree or above in Electrical Engineering or a related discipline.
- 5+ years of hands-on experience in high-complexity system-level hardware design, ideally focused on enterprise-grade networking or high-performance infrastructure equipment.
- Deep technical understanding of high-speed Ethernet design, high-speed differential signals (advanced SerDes, PCIe, multi-gigabit/ultra-high-speed interfaces), and high-density PCB design rules.
- Practical experience with complex power delivery networks (PDN), power integrity, and high-reliability system architectures (e.g., redundant power systems, hot-swappable modules).
- Hands-on proficiency in hardware validation, signal integrity measurement, debugging, and failure analysis.
- Familiarity with international compliance and environmental standards (EMC/EMI, ESD, Safety).
- Proficiency with standard EDA tools (OrCAD Capture, Cadence Allegro, or equivalent).
Nice to Have
- Experience with advanced system management architectures (e.g., remote management controllers and out-of-band management protocols).
- Knowledge of high-power density board design, advanced chassis thermal solutions, or modular architecture.
Additional Content
Responsibilities
- Lead hardware circuit design, schematic capture, and layout review for next-generation, high-density, and high-throughput networking platforms.
- Evaluate and integrate advanced switching architectures, management subsystems, and cutting-edge high-speed interconnect technologies.
- Drive hardware architecture design, system bring-up, high-speed signal integrity (SI) validation, and root-cause failure analysis.
- Partner with mechanical, thermal, and power engineering teams to address challenges related to high power density, thermal dissipation, and system-level reliability.
- Own BOM structure and support factory deployment to ensure seamless transition of high-layer-count PCBAs from NPI to mass production.
- Collaborate with cross-functional software, firmware, QA, and compliance teams throughout the entire product lifecycle.
Qualifications
- Bachelor’s degree or above in Electrical Engineering or a related discipline.
- 5+ years of hands-on experience in high-complexity system-level hardware design, ideally focused on enterprise-grade networking or high-performance infrastructure equipment.
- Deep technical understanding of high-speed Ethernet design, high-speed differential signals (advanced SerDes, PCIe, multi-gigabit/ultra-high-speed interfaces), and high-density PCB design rules.
- Practical experience with complex power delivery networks (PDN), power integrity, and high-reliability system architectures (e.g., redundant power systems, hot-swappable modules).
- Hands-on proficiency in hardware validation, signal integrity measurement, debugging, and failure analysis.
- Familiarity with international compliance and environmental standards (EMC/EMI, ESD, Safety).
- Proficiency with standard EDA tools (OrCAD Capture, Cadence Allegro, or equivalent).
Nice to Have
- Experience with advanced system management architectures (e.g., remote management controllers and out-of-band management protocols).
- Knowledge of high-power density board design, advanced chassis thermal solutions, or modular architecture.